ASMPT and IBM renewed their agreement on July 23, 2024, to further their collaboration in the development of chiplet packaging technologies. The partnership is dedicated to the improvement of thermocompression and hybrid bonding technology for chiplet packaging, utilizing ASMPT's next-generation Lithobolt hybrid bonding tools and Firebird TCB. Chiplets facilitate the efficient packaging of system-on-chip designs by dividing them into smaller components. This process accelerates the development of systems, reduces costs, and improves energy efficiency. Nevertheless, the rapid advancements in AI computation necessitate advancements in packaging technology to facilitate the transition of chiplets from research to commercial production.
This agreement expands upon prior collaboration endeavors that led to the development of a novel hybrid bonding methodology that enhances the quality of chiplet bonding. Huiming Bu, Vice President of IBM Semiconductors Global R&D, emphasized IBM's leadership in advanced packaging technologies for AI, while Lim Choon Khoon, Senior Vice President at ASMPT, expressed excitement about pushing the boundaries of advanced packaging and heterogeneous integration solutions. Headquartered in Singapore, ASMPT specializes in semiconductor and electronics manufacturing solutions, while IBM is a leading global provider of hybrid cloud and AI services, supporting clients in their digital transformations across various industries.
